F1 Solution

Test, Debug and validation of IC devices

Real time monitoring

Pitch can be as small as 0.35mm

Differential Line Return Loss(RL)

Differential Line Insertion Loss(IL)

• F1 Solution is designed for fast validation & debug of IC device.like eMMC,DRAM, eMCP, UFS, LPDDR3,LPDD4.

• Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after desoldering.

• F1 Solution is based on customer's platform, ensure debug environment is the same as application.

• Innovation design of Interposer is compatible with different product. Device debug can start after solder the interposer on PCBA.

• Provide signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an Infiniium oscilloscope.

• Provide direct signal access to BGA package for true compliance testing.
  

• Provide customized interposer development.

  
  

Mechanical 

Material Socket Body：　              Peek Ceramic/Torlon/PEI/PPS

Material Socket Lid：　　              AL，POM

Contact：                                         Pogo Pin

Operation Temperature:　　        -40 ~ 140 ℃

Life Span:                                         100K Cycles

Spring Force:　                                20g ~ 30g per Pin

Electrical

Current Rating：　　                      3A

DC Resistance：                              Max. 100mΩ