Suitbale for CSP、BGA devices with pitch from 0.2mm to 1.27mm or bigger.
Advance equipment and process ensure high yield reate.
POP devices with recession can also be rewored and with high yield rate.
Rapid Response with TAT below 3 days for most cases from chip received to chip delivery
High Yield Rate
Provide Detailed Report
Work with Customer closely
Standard process of semiconductor FA( Failure Analysis) support and Rework solution were developed as below: