self-heating test socket

Self-Heating Test Socket

A self-heating test socket is a specialized device designed to rapidly validate chips by independently heating the device under test (DUT) without affecting surrounding components. This capability speeds up development cycles and reduces costs by eliminating the need for large-scale thermal conditioning.

Application： Semiconductor reliability validation, parametric testing, failure analysis, and wafer/package final testing.

Nb of Pins： 3~3000

Pitch： Above 0.3 pitch

Self-Heating Test Socket

Direct In-Situ IC Heating: Eliminates the need for external ovens, reducing dependency on bulky thermal chambers.
Space & Cost Savings: Compact design conserves space and cuts oven-related expenses.
Customizable Solutions: Tailored heating components to meet specific customer requirements.
Mass Production Compatibility: Ideal for high-volume burn-in testing, delivering significant economic benefits.

Sireda

This test socket can route signals to the customer's test motherboard via adapter probes.

Sireda

Independent temperature control module, designed for rapid validation during R&D initial phases.

Independent Temperature Control: Heats only the target chip, preventing thermal interference with other components and simplifying test setup.
High Flexibility: Seamlessly transitions from lab-scale validation to high-volume production testing.
Cost Efficiency: Reduces reliance on traditional thermal chambers/large-scale temperature control systems, lowering hardware investments.
Typical Applications: Semiconductor reliability testing, parametric characterization, failure analysis, and final package testing.