Support: PCIe Gen4 and SAS4.0

Temperature Forcing Workstation - Precision Hot/Cold Test for Semiconductor ICs

A Temperature Cycling Workstation is a test system used in semiconductor and electronics validation to repeatedly expose devices to controlled heating and cooling cycles.

Instead of maintaining a constant temperature, it forces the device under test (DUT) through rapid transitions between high and low temperatures, simulating real-world operating conditions and thermal stress.

  • Application: BGA, LGA, QFN, QFP,SOP
  • Nb of Pins: No limit
  • Pitch: 0.35mm or above

Desktop Thermal Chambers | Fast, Localized Chip Testing Solution



  • Temperature range coverage: -55°C to 150°C

  • Fast thermal transitions

  • Energy-efficient, device-level control

  • Compact benchtop design

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Our benchtop thermal test system delivers rapid temperature transitions from -55°C to +150°C, achieving -40°C in just 7 minutes - perfect for accelerated life testing and failure analysis. The localized temperature control technology minimizes thermal mass impact while providing precise chip-level temperature forcing. This compact solution significantly reduces development time and testing costs compared to full-chamber systems, making it ideal for engineering labs performing:

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Sireda Technology have developed test fixture , test socket  for most BGA, QFN, PGA  package, please contact us via sales@sireda.com for more detail.