Manual Test Socket

Clamshell (CS) Test Socket

Test, validation or burn in test of IC devices

Package can be BGA, QFN, LGA, QFP, SOP, etc

Pitch can be as small as 0.35mm

CS test socket is designed for test, valiation or burn in test of IC devices like eMMC, eMCP, UFS, DDR, LPDDR, Nand, etc.
Can be applied as well for chip-off IC devices failure analysis, write-and-read in forensic application.
Patented structural rolling design with socket clamp makes it easy opeartion, less abrasion, so as to better socket life span.
Customized design and service according to customer's volume requirements, two options can be chosen, machined socket (for small volume) and molded socket (for big volume of more than 500 pcs).
Customzied PCB board can be sold together with socket under customer's request.

Mechanical

Material Socket Body：　 Torlon/PPS/PEI

Material Socket Lid：　　 AL/PEI

Contact： Pogo Pin

Operation Temperature:　　 -40 ~ 140 ℃

Life Span: 30K ~ 50K Cycles

Spring Force:　 20g ~ 40g per Pin

Electrical

Current Rating：　　 1A

DC Resistance： Max. 100mΩ

Part Number	Name	Description	Package	Pin Nb	Material
702-0000034	Test Socket	QFN20 0.4mm FPC2050 CS 3x3mm	QFN	20	PPS
702-0000047	Test Socket	LGA68 1.27mm NA CS 16.1x10.1mm	LGA	68	Peek Ceramic
702-0000084	Test Socket	SOP70 0.8mm MSP55LV100 CS 11.9x28.9mm	SOP	70	PPS
702-0000088	Test Socket	BGA162 0.5mm eMCP CS125 11.5x13mm B	BGA	162	PPS
702-0001093	Test Socket	MCM14 0.8mm 7005 CS125 10.5x10.5mm	MCM	14	Peek Ceramic

Sireda provide manual test Clamshell test socket for IC packages of BGA, LGA, QFN, QFP, SOP, etc. More CS socket please visit Clamshell Test Socket List. For more information, please contact sales@sireda.com

Sireda Technology|Test Socket|test fixture

Clamshell (CS) Test Socket

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