Automatic Test (ATE) Socket

Apply for automatice test, validation or burn in test of CPU, eMMC, eMCP, DDR, Nand, etc

System level or Functional test

Pitch can be as small as 0.35mm

ATE test socket is designed for Automatic test of IC devices like CPU, eMMC, eMCP, DDR, Nand, etc.
Socket structure can be designed according to customer's application, can be Open top type or ATE machine type.
Open Top (OT) test socket is mainly for burn in test.
ATE test socket is suitalbe for different IC package of BGA, LGA, QFP, QFN, SOP, and so on.
With 15+ years of experience, socket can be design according to customer's specific requirements of frequency, current, resistance, etc.
Floating design provide better contact and protect DUT from damage.

Mechanical

Material Socket Body：　 Peek Ceramic/Torlon/PPS

Material Socket Lid：　　 AL，POM

Contact： Pogo Pin

Operation Temperature:　　 -40 ~ 140 ℃

Life Span: 100K Cycles

Spring Force:　 20g ~ 30g per Pin

Electrical

Current Rating：　　 3A

DC Resistance： Max. 100mΩ

Part Number	Name	Description	Package	Pin Nb	Material	Remarks
702-0000025	Test Socket	QFN48 0.4mm CT 6x6mm B	QFN	48	Peek Ceramic	ATE
702-0000883	Test Socket	SOP24 0.65mm NA ATE 4.4x7.8mm	SOP	24	Peek Ceramic	ATE
702-0000933	Test Socket	LGA24 0.5mm GSL6101 ATE 3x3mm	LGA	24	PPS	ATE
702-0000625	Test Socket	DFN8 1.0mm NA OT 4x4.2mm	DFN	8	Peek Ceramic	Open Top
702-0000684	Test Socket	BGA12 0.5mm NA OT 2x2.2mm	BGA	12	PPS	Open Top

Sireda provide automatic test (ATE) socket for IC packages of BGA, LGA, QFN, QFP, SOP, etc. More ATE socket please visit Automatic Test (ATE) Socket List. For more information, please contact sales@sireda.com

Automatic Test (ATE) Socket

Recommend

Mobile Phone Test Fixture

IGBT Test Socket

IPM TEST SOCKET

DDR Test Fixture