Support: PCIe Gen4 and SAS4.0

FA Support

Provide semiconductor FA support. work with world's famous IC design company for many years, these experiences have enabled us to bring high quality and low cost Failure Analysis.

  • Application: BGA,CSP
  • Nb of Pins: 0 ~ 1999
  • Pitch: 0.2mm or above

FA Support


Suitbale for CSP、BGA devices with pitch from 0.2mm to 1.27mm or bigger.

Advance equipment and process ensure high yield reate.

POP devices with recession can also be rewored and with high yield rate.

1498021773838812.gifRapid Response with TAT below 3 days for most cases from chip received to chip delivery

1498021773838812.gifHigh Yield Rate

1498021773838812.gifProvide Detailed Report

1498021773838812.gifWork with Customer closely



Standard process of semiconductor FA( Failure Analysis) support and Rework solution were developed as below:

FA support procedure.png