Support: PCIe Gen4 and SAS4.0

Burn-in Socket - Clamshell

Burn-in socket is mostly used for burn-in aging test of memory devices like eMMC, eMCP, ePOP, Nand, UFS, MicroSD, DDR, etc. It is not only for burn-in test, but also for functional test.

  • Application: BGA, LGA, QFN
  • Nb of Pins: 2~200
  • Pitch: 0.35mm or above

Burn-in Socket - Clamshell Type


1498021773838812.gifTest, validation or burn in test of IC devices

1498021773838812.gifPackage can be BGA, QFN, LGA, etc

1498021773838812.gifPitch can be as small as 0.35mm

1498021773838812.gifUsed for eMMC, eMCP, UFS, LPDDR, Nand, ePOP, etc...


burn-in socket application - 2.jpg

 Burn-in Socket for Nand Flansh BGA132/BGA152                                                                                                                                                          

Burn-in Socket CS Open.jpg

 Burn-in Socket for BGA153/BGA162/BGA221/BGA254/BGA100...                                                                                                                                                               

SOCKET DIM - 1.png

          eMMC BGA153 burn-in socket 701-0000050 drawing   

burn-in test.png

          eMMC BGA153 Burn-in Socket application                                       


  • Clamshell test burn-in socket is designed for test, validation or burn-in test of IC devices like eMMC, eMCP, UFS, LPDDR, Nand, ePOP, etc...

  • Patented structural rolling design with socket clamp makes it easy opeartion, less abrasion, so as to better socket life span.

  • It is a product with very compact space and with good cost effectiveness, good quality, small and exquisite, meets most of your test applications.

  • Customzied PCB board can be sold together with socket under customer's request.



Material Socket Body:               PEI

Material Socket Lid:                PEI

Contact:                                         Pogo Pin

Operation Temperature:          -40 ~ 125 ℃

Life Span:                                         20K ~ 30K Cycles

Spring Force:                                 20g ~ 40g per Pin


Current Rating:                        1A

DC Resistance:                              Max. 100mΩ

Part NumberNameDescriptionPackagePin NbMaterialRemark
Burn-in SocketBGA153 0.5mm eMMC CS100 11.5x13mmBGA33PEI
701-0000051Burn-in SocketBGA132 1.0mm Nand CS100 12x18mmBGA
701-0000101Burn-in SocketMicroSD Card CS100 11x15mmLGA17
701-0000121Burn-in SocketBGA254 0.5mm uMCP CS100 11.5x13mmBGA56PEI
701-0000231Burn-in SocketBGA153 0.5mm UFS3.1 CS100 11.5x13mmBGA112PEI

Sireda provide manual test Clamshell burn-in socket for IC packages of BGA, LGA, QFN, etc. More burn-in socket please or more information, please contact