Burn-in Socket - Clamshell Type
Burn-in Socket for Nand Flansh BGA132/BGA152 Burn-in Socket for BGA153/BGA162/BGA221/BGA254/BGA100... | eMMC BGA153 burn-in socket 701-0000050 drawing eMMC BGA153 Burn-in Socket application |
| Mechanical Material Socket Body: PEI Material Socket Lid: PEI Contact: Pogo Pin Operation Temperature: -40 ~ 125 ℃ Life Span: 20K ~ 30K Cycles Spring Force: 20g ~ 40g per Pin Electrical Current Rating: 1A DC Resistance: Max. 100mΩ |
Part Number | Name | Description | Package | Pin Nb | Material | Remark |
---|---|---|---|---|---|---|
701-0000050 | Burn-in Socket | BGA153 0.5mm eMMC CS100 11.5x13mm | BGA | 33 | PEI | |
701-0000051 | Burn-in Socket | BGA132 1.0mm Nand CS100 12x18mm | BGA | 88 | PEI | |
701-0000101 | Burn-in Socket | MicroSD Card CS100 11x15mm | LGA | 17 | PEI | |
701-0000121 | Burn-in Socket | BGA254 0.5mm uMCP CS100 11.5x13mm | BGA | 56 | PEI | |
701-0000231 | Burn-in Socket | BGA153 0.5mm UFS3.1 CS100 11.5x13mm | BGA | 112 | PEI |
Sireda provide manual test Clamshell burn-in socket for IC packages of BGA, LGA, QFN, etc. More burn-in socket please or more information, please contact sales@sireda.com.