Open Top Burn In Socket

Open Top Test Socket

• Suitable for BGA, QFN, LGA, and other package types.

• Suitable for testing, verification, programming, and other processes of semiconductor products.                                                                                                                    
  

• Suitable for burn in test of eMMC, eMCP, UFS, LPDDR, NAND, ePOP, and other Chips

• Operating temperature：-40 ~ 125 degree
  

eMMC, UFS OT Burn In Socket

    eMMC BGA153 Test Socket 711-0000004

                弹簧探针                                                  微针弹片

• Open-top test sockets are mainly used for fast validation, testing, and programming of chips such as eMMC, eMCP, UFS, DDR, LPDDR, Nand, and ePOP.

• When paired with handler, the efficiency of testing and tray pick-and-place is high.

• The product is stable, reliable, and offers a high price-performance ratio.

• The design of the burning socket is compact, saving customers a significant amount of space and improving the efficiency of aging chambers.

• Contact Pin: Pogo Pin or S pin

• According to customer needs, we can also provide customized PCB boards .
  

Mechanical 

Material Socket Body：　              PEI

Contact：                                         Blade Pin

Operation Temperature:　　        -40 ~ 125 ℃

Life Span:                                         300K ~ 500K Cycles

Spring Force:　                                20g ~ 40g per Pin

Electrical

Current Rating：　　                      1A

DC Resistance：                              Max. 100mΩ

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