USB Solution for eMMC HS400 UFS
BGA153 eMMC - KLMCG8GEND-B031 |
BGA221 eMCP - KMRC10014M-B809 BGA254 eMCP - KMDH6001DM-B422 BGA153 UFS - KLUCG4J1CB - B0B1 |
USB version 3.0. | Mechanical Material Socket Body: PEEK Ceramic/PPS Material Socket Lid: AL, POM Contact: Pogo Pin Operation Temperature: -40 ~ 140 ℃ Life Span: 50K Cycles Spring Force: 20g ~ 30g per Pin Electrical Current Rating: 1.5A DC Resistance: <100mΩ@0.65mm |
Part Number | Name | Description | Package | Pin Nb | Material | Remark |
---|---|---|---|---|---|---|
702-0001327 | Card Reader | BGA153 0.5mm eMMC CS100 11.5x13mm HS400 USB | BGA | 153/169 | PEEK Ceramic/PPS | |
702-0001328 | Card Reader | BGA162 0.5mm eMCP CS100 11.5x13mm HS400 USB | BGA | 162/186 | PEEK Ceramic/PPS | |
702-0001329 | Card Reader | BGA221 0.5mm eMCP CS100 11.5x13mm HS400 USB | BGA | 221 | PEEK Ceramic/PPS | |
702-0001330 | Card Reader | BGA254 0.5mm eMCP CS100 11.5x13mm HS400 USB | BGA | 254 | PEEK Ceramic/PPS | |
702-0001331 | Card Reader | BGA153 0.5mm UFS CS100 11.5x13mm USB | BGA | 153 | PEEK Ceramic/PPS |
Sireda provide USB Solution for memory IC chip HS400 data accessing, writting and reading. More USB Solution, please visit USB Solution Product List . For more information, please contact sales@sireda.com