Socket – TO Package Test Socket
- PacakgeThe transistor outline (TO) package
- Nb of Pins2~20
- Pitch1.0mm ~ 2.54mm
It is used for burn in test of the transistor outline (TO) package, optical devices or coaxial devices in package, including two families of TO46 and TO56.
We offer 2 series of TO socket:
Material Module Body： LCP, PPS
Contact material： Beryllium copper with Au plating
Operation Temperature: 120 ~ 135 ℃
Life Span: 20K Cycles
Spring Force: 30g ~ 50g per Pin
Current Rating： 2A
DC Resistance： Max. 50mΩ
Contact reliability: 99.5%
The transistor outline (TO) pacakge family consists of many types of packaging solution for transistors and similar discrete devices as weel as simple IC's with low pin counts. We mainly offer two TO package series test socket.
One is TO56 with outer diameter of 5.6 mm. The main application range is conventional optical devices, because the size of 5.6 mm is moderate, which is consistent with the structure of conventional SFP module and XFP module, so it has been greatly developed. At present, it is mainly used in LD-TO devices.
The other one is TO46 mainly used in PD-TO.
Sireda provide a wide range of sockets for BGA, QFN, QFP, connector, FPC, connector, etc. For more information, please contact firstname.lastname@example.org.