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    Rework Service

    • PacakgeBGA
    • Nb of Pins1~2999
    • Pitch0.3mm or above

    Focuse on precision BGA rework, advance equipment and process ensures high yield rate. also provide BGA testing service.

    1. Detailed information

    Rework Service

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    semiconductor test | Sireda Test Socket




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    Focus on precision BGA

    We have a skilled team to provide BGA IC rework, minimum pitch can be 0.3mm. For POP (package on package) IC, can also be done very well. CPU IC with a few capacitors can also be dealt very well.


    • RoHS compliant

    • Reasonable temperature curve ensure good reball

    • ESD protection

    • Residual tin in pad recess can be removed perfectly

    • Skilled technicians and mature process

    • Reball kits and fixtures are designed and made in house

    semiconductor test | Sireda Test Socket

    semiconductor test | Sireda Test Socket

    semiconductor test | Sireda Test Socket



    TAG:   bga rework bga reball pop reball
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