F Solution - Fast validation tools

F Solution

 Test, Debug and validation of IC devices

 Complete solution for fast validation

 Pitch can be as small as 0.35mm

• F Solution is designed for fast validation & test of IC device.like eMMC,DRAM, eMCP, UFS, LPDDR3,LPDD4.

• Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after desoldering.

• Innovation design of Interposer is compatible with different product. Device debug can start after solder the interposer on PCBA.
  

• Provide signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an Infiniium oscilloscope.

• Provide direct signal access to BGA package for true compliance testing.
  

• Customized interposer development.

  
  

Mechanical 

Material Socket Body：　              Peek Ceramic

Material Socket Lid：　　              AL, Cu, POM

Contact：                                         Pogo Pin

Operation Temperature:　　        -40 ~ 140 ℃

Life Span:                                         100K Cycles

Spring Force:　                                20g ~ 30g per Pin

Electrical

Current Rating：　　                      1.0A

DC Resistance：                              Max. 100mΩ