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F Solution - Fast validation tools
- PacakgeBGA
- Nb of Pins2~1999
- Pitch0.35mm or above
provide IC test socket with interposer, able to test on multi platform. apply to test controller, flash, DRAM, eMMC,etc.
F Solution
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| Mechanical Material Socket Body: Peek Ceramic Material Socket Lid: AL, Cu, POM Contact: Pogo Pin Operation Temperature: -40 ~ 140 ℃ Life Span: 100K Cycles Spring Force: 20g ~ 30g per Pin Electrical Current Rating: 1.0A DC Resistance: Max. 100mΩ |
Part Number | Name | Description | Package | Pin Nb | Material | Remark |
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702-0000181 | F Solution | BGA78 0.8mm DDR DT100 10.5x12mm F A | BGA | 78 | Peek Ceramic | |
702-0000159 | F Solution | BGA153 0.5mm eMMC DT100 11.5x13mm F A | BGA | 153 | Peek Ceramic | |
702-0000250 | F Solution | BGA84 0.8mm DDR DT100 8x13mm F | BGA | 84 | Peek Ceramic | |
702-0000266 | F Solution | BGA95 0.65mm UFS DT100 11.5x13mm F A | BGA | 95 | Peek Ceramic | |
702-0000273 | F Solution | BGA178 0.65mm LPDDR DT100 10.5x11.5mm F A | BGA | 178 | Peek Ceramic |
Sireda provide full solution for IC device fast validation & debug. More F solution please visit F1 Solution Product List.
For customized Interposer, please contact sales@sireda.com.
TAG:  bga interposer DRAM test IC test socket
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