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    F1 Solution

    • PacakgeBGA
    • Nb of Pins1~1999
    • Pitch0.35mm or above

    F1 Solution provide signal access to the clock, strobe, data, address and command signals to IC device for making electrical and timing measurements with an Infiniium oscilloscope.

    1. Detailed information

    F1 Solution

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    1498021773838812.gif Test, Debug and validation of IC devices

    1498021773838812.gif Real time monitoring

    1498021773838812.gif Pitch can be as small as 0.35mm

    BGA153 UFS Tool.jpg




    Return loss.png

    Differential Line Return Loss(RL)


    Insertion Loss.png

    Differential Line Insertion Loss(IL)


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    • F1 Solution is designed for fast validation & debug of IC device.like eMMC,DRAM, eMCP, UFS, LPDDR3,LPDD4.

    • Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after desoldering

    • F1 Solution is based on customer's platform, ensure debug environment is the same as application.

    • Innovation design of Interposer is compatible with different product. Device debug can start after solder the interposer on PCBA.

    • Provide signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an Infiniium oscilloscope.

    • Provide direct signal access to BGA package for true compliance testing.

    • Customized interposer development.


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    Mechanical 

    Material Socket Body:               Peek Ceramic/Torlon/PEI/PPS

    Material Socket Lid:                AL,POM

    Contact:                                         Pogo Pin

    Operation Temperature:          -40 ~ 140 ℃

    Life Span:                                         100K Cycles

    Spring Force:                                 20g ~ 30g per Pin


    Electrical

    Current Rating:                        3A

    DC Resistance:                              Max. 100mΩ



    Part NumberNameDescriptionPackagePin NbMaterialRemark
    702-0000624F1 SolutionBGA153 0.5mm eMMC DT100 11.5x13mm F1 A BGA153Peek陶瓷
    702-0000953F1 SolutionBGA153 0.5mm UFS DT-mini 11.5x13mm F1BGA153Peek陶瓷
    702-0000723F1 SolutionBGA162 0.5mm eMCP DT100 11.5x13mm F1 A BGA162Peek陶瓷
    702-0000783F1 SolutionBGA169 0.5mm eMMC DT100 12x18mm F1 A BGA169Peek陶瓷
    702-0001001F1 SolutionBGA221 0.5mm eMCP DT100 11.5x13mm F1 A BGA221Peek陶瓷

    Sireda provide full solution for IC device fast validation & debug. More F1 solution please visit F1 Solution Product List.

    For customized Interposer, please contact sales@sireda.com



    TAG:  F1 solution bga interposer
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