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    Burn-in Socket - Clamshell

    • PacakgeBGA, LGA, QFN
    • Nb of Pins2~200
    • Pitch0.35mm or above

    Burn-in socket is mostly used for burn-in aging test of memory devices like eMMC, eMCP, ePOP, Nand, UFS, MicroSD, DDR, etc. It is not only for burn-in test, but also for functional test.

    1. Detailed information

    Burn-in Socket - Clamshell Type

    1501071209540632.png                            

    1498021773838812.gif Test, validation or burn in test of IC devices

    1498021773838812.gif Package can be BGA, QFN, LGA, etc                                            

    1498021773838812.gif Pitch can be as small as 0.35mm

    1498021773838812.gif Used for eMMC, eMCP, UFS, LPDDR, Nand, ePOP, etc...

          

    burn-in socket application - 2.jpg

     Burn-in Socket for Nand Flansh BGA132/BGA152                                                                                                                                                          

    Burn-in Socket CS Open.jpg

     Burn-in Socket for BGA153/BGA162/BGA221/BGA254/BGA100...                                                                                                                                                               


    SOCKET DIM - 1.png

              eMMC BGA153 burn-in socket 701-0000050 drawing   


    burn-in test.png

              eMMC BGA153 Burn-in Socket application                                       

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    • Clamshell test burn-in socket is designed for test, validation or burn-in test of IC devices like eMMC, eMCP, UFS, LPDDR, Nand, ePOP, etc...

    • Patented structural rolling design with socket clamp makes it easy opeartion, less abrasion, so as to better socket life span.

    • It is a product with very compact space and with good cost effectiveness, good quality, small and exquisite, meets most of your test applications.

    • Customzied PCB board can be sold together with socket under customer's request.


    1514363948533830.png

    Mechanical 

    Material Socket Body:               PEI

    Material Socket Lid:                PEI

    Contact:                                         Pogo Pin

    Operation Temperature:          -40 ~ 125 ℃

    Life Span:                                         20K ~ 30K Cycles

    Spring Force:                                 20g ~ 40g per Pin


    Electrical

    Current Rating:                        1A

    DC Resistance:                              Max. 100mΩ



    Part NumberNameDescriptionPackagePin NbMaterialRemark
    701-0000050
    Burn-in SocketBGA153 0.5mm eMMC CS100 11.5x13mmBGA33PEI
    701-0000051Burn-in SocketBGA132 1.0mm Nand CS100 12x18mmBGA
    88PEI
    701-0000101Burn-in SocketMicroSD Card CS100 11x15mmLGA17
    PEI
    701-0000121Burn-in SocketBGA254 0.5mm uMCP CS100 11.5x13mmBGA56PEI
    701-0000231Burn-in SocketBGA153 0.5mm UFS3.1 CS100 11.5x13mmBGA112PEI

    Sireda provide manual test Clamshell burn-in socket for IC packages of BGA, LGA, QFN, etc. More burn-in socket please or more information, please contact sales@sireda.com.


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