Mobile Phone Test Fixture

Mobile Phone Test Fixture System level test platform Apply to CPU, memory, power module testing Pitch from 0.35mm to 1.27mmSocket phone is designed for test, debug and validation of CPU

  • Pacakge: BGA, LGA, QFP, QFN,SOP, MCM
  • Nb of Pins: 1 ~ 1999
  • Pitch: 0.35mm and above

Mobile Phone Test Fixture

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1498021773838812.gif System level test platform

1498021773838812.gif Apply to CPU, memory, power module testing

1498021773838812.gif Pitch from 0.35mm to 1.27mm

Socket Phone.jpg


图片关键词


图片关键词

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  • Socket phone is designed for test, debug and validation of CPU,

    eMMC, eMCP, DDR, Flash, Controller, WiFi,etc.

  • Patented Interposer design avoid problems of pad co-planarity

    oxidation and damage of PCB board after desoldering.

  • Suitable for devices system level test and verification of mobile

    phone, tablet PC, etc at product development.

  • 可提供高度客制化的服务,根据客户要求提供测试接口等。 

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Mechanical 

Material Socket Body:               Peek Ceramic/Torlon

Material Socket Lid:                AL,Cu, POM

Contact:                                         Pogo Pin

Operation Temperature:          -40 ~ 120 ℃

Life Span:                                         100K Cycles

Spring Force:                                 20g ~ 30g per Pin


Electrical

Current Rating:                        3A

DC Resistance:                              Max. 100mΩ

转接板在手机测试治具(Socket Phone)中的应用

手机测试治具,又称Socket Phone. 斯纳达科技设计的Socket Phone都采用了转接板(Interposer)设计。相比传统的手机测试治具,带转接板设计的产品具有以下特点:

  • dt-11.gif 避免了手机PCBA因残留锡渣导致接触不稳定

  • dt-11.gif Pogo Pin直接作用在转接板上,更好的保护客户的PCBA。传统设计中Pogo Pin直接作用于客户PCBA上,多次测试后会导致客户PCBA PAD刺破

  • dt-11.gif 转接板采用镀厚金工艺,保证了治具更具耐磨性,相比同类产品测试寿命更长

     

Interposer.jpg

我司拥有主流的CPU测试工具,如MSM8953、MSM8998, 更多手机测试治具方案请点击手机测试治具目录