Support: PCIe Gen4 and SAS4.0

F1 Solution

F1 Solution provide signal access to the clock, strobe, data, address and command signals to IC device for making electrical and timing measurements with an Infiniium oscilloscope.

  • Application: BGA
  • Nb of Pins: 1~1999
  • Pitch: 0.35mm or above
F1 Solution

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1498021773838812.gifTest, Debug and validation of IC devices

1498021773838812.gifReal time monitoring

1498021773838812.gifPitch can be as small as 0.35mm

BGA153 UFS Tool.jpg




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Differential Line Return Loss(RL)


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Differential Line Insertion Loss(IL)


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  • F1 Solution is designed for fast validation & debug of IC device.like eMMC,DRAM, eMCP, UFS, LPDDR3,LPDD4.

  • Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after desoldering.

  • F1 Solution is based on customer's platform, ensure debug environment is the same as application.

  • Innovation design of Interposer is compatible with different product. Device debug can start after solder the interposer on PCBA.

  • Provide signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an Infiniium oscilloscope.

  • Provide direct signal access to BGA package for true compliance testing.

  • Provide customized interposer development.


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Mechanical 

Material Socket Body:               Peek Ceramic/Torlon/PEI/PPS

Material Socket Lid:                AL,POM

Contact:                                         Pogo Pin

Operation Temperature:          -40 ~ 140 ℃

Life Span:                                         100K Cycles

Spring Force:                                 20g ~ 30g per Pin


Electrical

Current Rating:                        3A

DC Resistance:                              Max. 100mΩ



Part NumberNameDescriptionPackagePin Nb下针数MaterialRemark
702-0000624F1 SolutionBGA153 0.5mm eMMC DT100 11.5x13mm F1 A BGA15331Peek陶瓷
702-0000953F1 SolutionBGA153 0.5mm UFS DT-mini 11.5x13mm F1BGA153153Peek陶瓷
702-0000723F1 SolutionBGA162 0.5mm eMCP DT100 11.5x13mm F1 A BGA162162
Peek陶瓷
702-0000783F1 SolutionBGA169 0.5mm eMMC DT100 12x18mm F1 A BGA16931Peek陶瓷
702-0001001F1 SolutionBGA221 0.5mm eMCP DT100 11.5x13mm F1 A BGA221221Peek陶瓷

Sireda Technology provide full solution for IC device fast validation & debug. More F1 solution please visit F1 solution catalog.

For customized Interposer, please contact sales@sireda.com