Test Socket - F1 Solution

F1 Solution - 模板

F1 Solution provide signal access to the clock, strobe, data, address and command signals to IC device for making electrical and timing measurements with an Infiniium oscilloscope.

  • Pacakge: BGA
  • Nb of Pins: 1~1999
  • Pitch: 0.35mm or above

F1 Solution

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1498021773838812.gif Test, Debug and validation of IC devices

1498021773838812.gif Real time monitoring

1498021773838812.gif Pitch can be as small as 0.35mm

BGA153 UFS Tool.jpg




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Differential Line Return Loss(RL)


Insertion Loss.png

Differential Line Insertion Loss(IL)


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  • F1 Solution is designed for fast validation & debug of IC device.like eMMC,DRAM, eMCP, UFS, LPDDR3,LPDD4.

  • Patented Interposer design avoid problems of pad co-planarity oxidation and damage of PCB board after desoldering.

  • F1 Solution is based on customer's platform, ensure debug environment is the same as application.

  • Innovation design of Interposer is compatible with different product. Device debug can start after solder the interposer on PCBA.

  • Provide signal access to the clock, strobe, data, address and command signals to the BGA package for making electrical and timing measurements with an Infiniium oscilloscope.

  • Provide direct signal access to BGA package for true compliance testing.

  • Provide customized interposer development.


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Mechanical 

Material Socket Body:               Peek Ceramic/Torlon/PEI/PPS

Material Socket Lid:                AL,POM

Contact:                                         Pogo Pin

Operation Temperature:          -40 ~ 140 ℃

Life Span:                                         100K Cycles

Spring Force:                                 20g ~ 30g per Pin


Electrical

Current Rating:                        3A

DC Resistance:                              Max. 100mΩ



Part NumberNameDescriptionPackagePin Nb下针数MaterialRemark
702-0000624F1 SolutionBGA153 0.5mm eMMC DT100 11.5x13mm F1 A BGA15331Peek陶瓷
702-0000953F1 SolutionBGA153 0.5mm UFS DT-mini 11.5x13mm F1BGA153153Peek陶瓷
702-0000723F1 SolutionBGA162 0.5mm eMCP DT100 11.5x13mm F1 A BGA162162
Peek陶瓷
702-0000783F1 SolutionBGA169 0.5mm eMMC DT100 12x18mm F1 A BGA16931Peek陶瓷
702-0001001F1 SolutionBGA221 0.5mm eMCP DT100 11.5x13mm F1 A BGA221221Peek陶瓷

Sireda Technology provide full solution for IC device fast validation & debug. More F1 solution please visit F1 solution catalog.

For customized Interposer, please contact sales@sireda.com